Planarization composition for removing metal films

Details Planarization composition for removing metal films Planarization composition for removing metal films

1997-04-02

1999-11-30

Utech, Benjamin

Compositions

Etching or brightening compositions

252 792, 252 793, C09K 1300, C09K 1304

Patent

active

059936851

ABSTRACT:
A planarization composition is set forth in accordance with an embodiment of the invention. The composition comprises spherical silica particles having a weight average particle diameter which falls within the range from about 0.03.mu. to about 2.mu. and is mono-disperse in that at least about 90 weight percent of the particles have a variation in particle diameter from the average particle diameter of no more than about .+-.20%. A liquid carrier comprising up to 20 weight percent ROH, and an amine hydroxide which is NR.sub.4 OH or NR.sub.2 NR.sub.3 OH, where each R is HCH.sub.3, CH.sub.2 CH.sub.3, C.sub.3 H.sub.7 or C.sub.4 H.sub.9, in the amount of 0.1 to 10 weight percent; an oxidizer which is in the amount from about 0.5% to 15% weight percent; an acid stabilizer for adjusting the pH to fall within a range from about 7.0 to about 0.5; and the remainder is water. The invention also relates to a thinning, polishing and planarizing apparatus and to a method for carrying out the thinning, polishing and planarizing operation.

REFERENCES:
patent: 3877183 (1975-04-01), Deckert et al.
patent: 4842837 (1989-06-01), Shimizu et al.
patent: 5230833 (1993-07-01), Romberger et al.
patent: 5264010 (1993-11-01), Brancaleoni et al.
patent: 5614444 (1997-03-01), Farkas et al.
patent: 5654216 (1997-08-01), Adrian

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