Planarization apparatus and method

Details Planarization apparatus and method Planarization apparatus and method

2005-06-28

2005-06-28

Wilson, Lee D. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S065000, C451S288000, C451S287000, C451S057000

Reexamination Certificate

active

06910943

ABSTRACT:
A polishing stage is mounted on a body provided with a rough grinding stage and a fine grinding stage so that a wafer can be roughly ground, finely ground and polished in one planarization apparatus. The planarization apparatus also has a cleaning stage for cleaning a polishing pad of the polishing stage to thereby clean the dirty cleaning pad. The planarization apparatus is also provided with an etching unit to thereby perform a sequence of planarization from the rough grinding to the etching.

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EP Office Action, May 14, 2004.
EP Search Report, Dec. 19, 2002.
EP Office Action, May 14, 2004.

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