Electricity: magnetically operated switches – magnets – and electr – Electromagnetically actuated switches – Polarity-responsive
Patent
1995-11-01
1999-02-16
Donovan, Lincoln
Electricity: magnetically operated switches, magnets, and electr
Electromagnetically actuated switches
Polarity-responsive
335 80, 257415, H01H 5122
Patent
active
058724966
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to a planar type electromagnetic relay, manufactured using semiconductor element manufacturing techniques, and imethod of manufacturing thereof.
BACKGROUND ART
With the development of microelectronics involving the high integration of semiconductor devices, there is now a range of equipment which is both highly functional as well as being miniaturized. Industrial robot type control systems using a comparatively large amount of energy are also no exception. With this type of control system, control of high energy is controlled by an extremely small amount of energy, by incorporating microelectronics into the control equipment. As a result, problems with erroneous operation due to noise and the like arise, so that the demand for electromagnetic relays as final stage output devices is increasing.
Conventional electromagnetic relays occupy large volume, incomparably greater than that for semiconductor devices. Accordingly, in order to progress with miniaturization of equipment, miniaturization of electromagnetic relays is required.
Heretofore, the smallest standard wire wound type electromagnetic relay is 14 mm long, 19 mm wide and 5 mm high (refer to Ultra Thin Signal Relays, Matsushita Electric Publication, No. 35, pp27-31 (1987)).
Moreover, recently, in order to further miniaturize an electromagnetic relay, a planar type electromagnetic relay made using micro machining techniques has been proposed (refer to H Hosoka, H Kuwano and K. Yanagisawa, "Electromagnetic Micro Relays: Concepts and Fundamental Characteristics", Proc. IEEE MENS Workshop 93, (1993), pp.12-17).
With this planar type relay also however since the coil is a conventional wire wound type, miniaturization is limited.
The present invention takes into consideration the above situation, with the object of providing for further miniaturization of electromagnetic relays.
DISCLOSURE OF THE INVENTION
Accordingly, the planar type electromagnetic relay of the present invention comprises; a semiconductor substrate having a planar movable plate and a torsion bar for axially supporting the movable plate so as to be swingable in a perpendicular direction relative to the semiconductor substrate formed integrally therewith, a planar coil for generating a magnetic field by means of an electric current, laid on an upper face peripheral edge portion of the movable plate, and a movable contact portion provided on a lower face thereof, and an insulating substrate having a fixed contact portion provided on a lower face of the semiconductor substrate at a location wherein the fixed contact portion corresponds to said movable contact portion, and magnets forming pairs with each other arranged so as to produce a magnetic field at the planar coil portions on the opposite sides of the movable plate which are parallel with the axis of the torsion bar.
With such a construction, since the movable portion can be formed on the semiconductor substrate, and the planar coil formed on the movable plate, using a semiconductor element manufacturing process, then the coil portion can be made thinner and much smaller, enabling an electromagnetic rely very much smaller than conventional wire wound type devices.
The construction may also be such that an upper substrate is provided on an upper face of the semiconductor substrate, and the magnets are fixed to the upper substrate and to the insulating substrate on the lower face of the semiconductor substrate.
Moreover, the construction may be such that a movable plate accommodating space is tightly sealed by means of the upper substrate and the lower insulating substrate, and evacuated. The swinging resistance on the movable plate can thus be eliminated, enabling an increase in the response of the movable plate.
In this case, the movable plate accommodating space may be formed by providing a recess in a central portion of the upper substrate. A step in processing the semiconductor substrate to ensure a movable plate accommodating space in which the movable plate can swing freely can
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Patent Specification, 874,965, Inventors: D.F.A. McLachlan and L.S. Phillips, Filed: Oct. 6, 1959, Application Date: Jul. 9, 1958, Entitled: Improvements in or relating to Electrical Circuits or Circuit Elements.
Magnetically Driven Microactuator: Design Consideration by B. Wagner, W. Benecke, pp. 838-843, 11764 1st Int. Conf. on Micro Electro. Opto, Mechanic Systems and Components (1990) Berlin, DE.
Kenji Ono et al., "Extra Thin Signal Relay", Aug., 1987, Matsushita Kenko Giho No. 35.
Hiroshi Hosaka et al., "Electromagnetic Microrelays: Concepts and Fundamental Characteristics", Feb. 7-10, 1993, Fort Lauderdale, Florida--IEEE Robotics and Automation Society.
Asada Norihiro
Esashi Masayoshi
Donovan Lincoln
The Nippon Signal Co. Ltd.
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