Planar transformer assembly including non-overlapping primary an

Electric power conversion systems – Current conversion – Using semiconductor-type converter

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336 83, 336 96, 336200, 336212, 336232, 29606, H02M 7537, H01H 8502

Patent

active

055983278

ABSTRACT:
A planar transformer assembly includes an insulative layer, a first spiral winding thereon circumscribing a magnetic flux path, a second spiral winding thereon in non-overlapping relation to the first spiral winding circumscribing the magnetic flux path, and a ferrite core assembly including first and second core sections defining a shallow gap or passage within which the spiral windings are disposed. In one embodiment, a plurality of laminated insulative layers are provided with a primary winding including a plurality of series-connected spiral subwindings and a non-overlapping secondary winding formed on the various insulative layers. The non-overlapping structure and the order of the various windings minimize electric field gradients and thereby minimize electric field coupled noise currents.

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IBM Technical Disclosure Bulletin, "Low-Modulus Encapsulation System", by R. Braune, vol. II, No. 8, Jan. 1969, p. 904.

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