Planar semiconductor devices and method of making the same

Details Planar semiconductor devices and method of making the same Planar semiconductor devices and method of making the same

1978-12-22

1981-04-28

Tupman, W. C.

Metal working

Method of mechanical manufacture

Assembling or joining

29578, 29580, 29590, B01J 1700

Patent

active

042637090

ABSTRACT:
A semiconductor device includes a region of polycrystalline silicon on a portion of the surface of a body of semiconductor material. A layer of oxidized polycrystalline silicon is also on the semiconductor material body and extends to the polycrystalline silicon region. The surface of the silicon oxide layer is substantially coplanar with the surface of the polycrystalline silicon region so that a metal film conductor can be easily provided over the semiconductor device. The polycrystalline silicon region may be the gate of an MOS transistor or a conductive region of any type of semiconductor device. The semiconductor device is made by forming a polycrystalline silicon layer over the semiconductor material body, forming a mask on a portion of the polycrystalline silicon layer, reducing the thickness of the unmasked portion of the polycrystalline silicon layer and then oxidizing the unmasked portion of the polycrystalline silicon layer to form the oxide layer.

REFERENCES:
patent: 3911560 (1975-10-01), Amelio
patent: 4174562 (1979-11-01), Sanders

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