Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-08-28
1998-06-30
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361767, 361768, 361777, 174255, 174266, H01R 909, H05K 111
Patent
active
057743401
ABSTRACT:
A self-supporting redistribution structure for directly mounting a semi-conductor chip to a multilayer electronic substrate is separately fabricated and then laminated to the multilayer substrate. The redistribution structure comprises a dielectric layer having plated vias communicating between its two major surfaces, redistribution lines and input/output pads on its upper major surface and joining patterns on its lower margin surface for electrical connection with the multilayer substrate. The metal plating in the plated vias of the redistribution device connects respective input/output pads on the upper surface of the redistribution structures with the joining patterns on its lower major surface. Input/output pads define an even (planar) topography with the redistribution lines to facilitate flip chip joining.
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Microstructured Solder Mask by Means of Laser Ablation, IBM Technical Disclosure Bulletin, vol. 36, No. 11 Nov. 1993, H. Arnold, P. Lueck and W. Zapka
Chang Chi Shih
Egitto Frank Daniel
International Business Machines - Corporation
Picard Leo P.
Vigushin John B.
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