Planar programmable metallization memory cells

Active solid-state devices (e.g. – transistors – solid-state diode – Bulk effect device – Bulk effect switching in amorphous material

Reexamination Certificate

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Reexamination Certificate

active

07847278

ABSTRACT:
Programmable metallization memory cells that have an inert electrode and an active electrode positioned in a non-overlapping manner in relation to a substrate. A fast ion conductor material is in electrical contact with and extends from the inert electrode to the active electrode, the fast ion conductor including superionic clusters extending from the inert electrode to the active electrode. A metal layer extends from the inert electrode to the active electrode, yet is electrically insulated from each of the inert electrode and the active electrode by the fast ion conductor material. Methods for forming programmable metallization cells are also disclosed.

REFERENCES:
patent: 6348365 (2002-02-01), Moore et al.
patent: 6867114 (2005-03-01), Moore et al.
patent: 7056762 (2006-06-01), Moore et al.
patent: 2006/0284214 (2006-12-01), Chen
patent: 2007/0064352 (2007-03-01), Gill
patent: 2007/0138458 (2007-06-01), Lung
patent: 2008/0001137 (2008-01-01), Kozicki et al.
patent: 2008/0006812 (2008-01-01), Kozicki et al.
patent: 2008/0277642 (2008-11-01), In T Zandt et al.
Chen et al., Ultra-Thin Phase-Change Bridge Memory Device Using GeSb, 2006 IEEE.
Kozicki et al., Nanoscale Memory Elements Based on Solid-State Electrolytes, IEEE Transactions on Nanotechnology, vol. 4, No. 3, May 2005.

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