Planar penning magnetron sputtering device

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

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2041922, C23C 1500

Patent

active

046295488

ABSTRACT:
An improved magnetron sputter source particularly suitable for magnetic materials is provided in the forming of an unfolded Penning discharge source. The two cathodes are in the form of an inner cathode roughly coplanar with an outer cathode ring. An anode radially between the cathodes is raised above the cathode surfaces so as to block line of sight from the inner cathode surface to the outer. A magnetic flux vector is imposed which passed from one cathode surface to the other. Raising the anode surface about one-fourth inch above the cathode surfaces allows raising the applied voltage so that a source of 5 kilowatts or greater is possible. Raising the anode also spreads the distribution of discharge more uniformly over the target surface and permits low pressure operation thereby facilitating good adhesion and uniform coverage of the substrate.

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"Magnetron Sputtering Sources for Ferromagnetic Material", J. Vac. Sci. Technol. A 3(1), Jan./Feb. 1985, pp. 10-13-B. Window and F. Sharples.

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