Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Reexamination Certificate
2005-06-14
2005-06-14
Fourson, George (Department: 2823)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Including integrally formed optical element
C385S014000, C385S130000, C385S143000
Reexamination Certificate
active
06905904
ABSTRACT:
A method of preparing a planar optical waveguide assembly, comprising the steps of (i) applying a curable polymer composition to a surface of a substrate to form a polymer film; (ii) curing the polymer film to form a lower clad layer; (iii) applying a silicone composition to the lower clad layer to form a silicone film; (iv) exposing at least one selected region of the silicone film to radiation having a wavelength of from 150 to 800 nm to produce a partially exposed film having at least one exposed region and at least one non-exposed region; (v) removing the non-exposed region of the partially exposed film with a developing solvent to form a patterned film; and (vi) heating the patterned film for an amount of time sufficient to form at least one silicone core having a refractive index of from 1.3 to 1.7 at 23° C. for light having a wavelength of 589 nm; wherein the lower clad layer has a refractive index less than the refractive index of the silicone core. A planar optical waveguide assembly prepared according to the method of the invention.
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Pending patent application, “Semiconductor Package and Method of Preparing Same,” Becker et. al., Dow Corning Corporation, Application No. 789083, Application date Feb. 20, 2002.
Gardner Geoffrey Bruce
Schmidt Randall Gene
Dow Corning Corporation
Fourson George
Garcia Joannie Adelle
Milco Larry A.
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