Planar non-magnetic optical isolator

Optical waveguides – Integrated optical circuit

Reexamination Certificate

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C385S045000, C385S002000

Reexamination Certificate

active

11322519

ABSTRACT:
An optical isolator is disclosed. An apparatus according to aspects of the present invention includes a Mach-Zehnder Interferometer (MZI) disposed in semiconductor material. The MZI has first and second arms. An optical beam is to propagate through the MZI in a forward direction. The apparatus further includes first and second optical modulators disposed in the first and second arms, respectively, of the MZI. The first and second optical modulators have traveling wave electrodes, which are coupled to receive first and second traveling wave signals, respectively. The first and second traveling wave signals are to generate traveling waves in the MZI that propagate in a reverse direction opposite to the forward direction. The first and second traveling wave signals to have a pi phase shift relative to each other such that there is constructive interference of the optical beam propagating through the MZI in the forward direction and there is destructive interference of an optical beam propagating through the MZI in the reverse direction.

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patent: 6947619 (2005-09-01), Fujita et al.
patent: 2006/0222283 (2006-10-01), Salib et al.
Giboney, K. S., “Traveling-Wave Photodetectors,” IEEE Photonics Technology Letters, vol. 4, No. 12, Dec. 1992, pp. 1363-1365.
Yokoi, H. et al., “Feasibility of Integrated Optical Isolator with Semiconductor Guiding Layer Fabricated by Wafer Direct Bonding,” IEEE Proc.-Optoelectron., vol. 146, No. 2, Apr. 1999, pp. 105-110.
Levy, M., “The On-Chip Integration of Magnetooptic Waveguide Isolators,” IEEE Journal of Selected Topics in Quantum Electronics, vol. 8, No. 6, Nov./Dec. 2002, pp. 1300-1306.
Bhandare, S. et al., “Novel Nonmagnetic 30-dB Traveling-Wave Single-Sideband Optical Isolator Integrated in III/V Material,” IEEE Journal of Selected Topics in Quantum Electronics, vol. 11, No. 2, Mar./Apr. 2005, pp. 417-421.

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