Planar multi-level metal process with built-in etch stop

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357 54, 357 65, H01L 4348, H01L 2934, H01L 2944, H01L 2952

Patent

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044478240

ABSTRACT:
Use of a dual composite mask for a lift-off multi-layered structure process in which a base component layer acts as an etch stop for reactive ion etching of overlying layers.

REFERENCES:
patent: 3985597 (1976-10-01), Zielinski
patent: 4184909 (1980-01-01), Chang et al.

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