Planar magnetron sputtering device

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

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C23C 1500

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active

041629540

ABSTRACT:
A planar magnetron sputtering device where the magnetic lines of force pass through the center of the planar cathode at angles of 45.degree. or less with respect to the planar surface of the cathode to thereby promote uniformity of cathode erosion. The magnetic structure may comprise mangetic tape stacked or rolled to form a solid, flat coil parallel to the cathode where at least some of the tape is tipped or slanted with respect to the cathode. Other magnetic structures are also disclosed which promote uniformity of cathode erosion.

REFERENCES:
patent: 3878085 (1975-04-01), Corbani
patent: 3956093 (1976-05-01), McLeod
patent: 4060470 (1977-11-01), Clarke
patent: 4100055 (1978-07-01), Rainey
patent: 4116806 (1978-09-01), Love et al.
T. Van Vorous, "Planar Magnetron Sputtering; a New Industrial Coating Technique", Solid State Technology, Dec. 1976, pp. 62-66.
J. S. Chapin, "The Planar Magnetron", Research/Development, Jan. 1974, pp. 37-40.
J. A. Thornton, "Magnetron Sputtering: Basic Physics & Application to Cylindrical Magnetrons", J. Vac. Sci. Technol., pp. 171-177 (1978).
Product Literature, "Dynamic Planar Magnetron Sputtering Source", Sloan Technology Corp., Santa Barbara, Calif. (1977).

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