Planar magnetron sputtering apparatus and its magnetic source

Details Planar magnetron sputtering apparatus and its magnetic source Planar magnetron sputtering apparatus and its magnetic source

1988-08-26

1989-10-10

Nguyen, Nam X.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20419212, C25C 1434

Patent

active

048729647

ABSTRACT:
A planer magnetron sputtering apparatus having a magnetic source which is rotated eccentrically around the axis of the target and has a particular arrangement of a plurality of permanent magnets to form the magnetic field. Using this particular arrangement of permanent magnets, the target surface is exposed to the plasma for the same period of time, and this increases the uniformity of the target erosion and deposits the sputtered material uniformly on the substrate, as a result, an increase of the lifetime of the target can be expected.

REFERENCES:
patent: 3878085 (1975-04-01), Corbani
patent: 4022947 (1977-05-01), Grubb et al.
patent: 4162954 (1979-07-01), Morrison, Jr.
patent: 4361472 (1982-11-01), Morrison, Jr.
patent: 4444643 (1984-04-01), Garrett
patent: 4466877 (1984-08-01), McKelvey
patent: 4498969 (1985-02-01), Ramachandran
patent: 4552639 (1985-11-01), Garrett
patent: 4557819 (1985-12-01), Meacham et al.

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