Planar magnetron sputtering apparatus

Details Planar magnetron sputtering apparatus Planar magnetron sputtering apparatus

1982-03-01

1984-02-28

Demers, Arthur P.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

204192R, C23C 1500

Patent

active

044340427

ABSTRACT:
A planar magnetron sputtering apparatus which minimizes contamination and controls the plasma for efficient power usage. The apparatus can be used in any orientation in most available vacuum systems. The power and coolant lines are at ambient pressure and are not exposed to the argon sputtering atmosphere. All seals in the apparatus are removed from the target area.

REFERENCES:
patent: 4198283 (1980-04-01), Class et al.
patent: 4265729 (1981-05-01), Morrison
patent: 4282083 (1981-08-01), Kertesz et al.
Thornton; J. Vac. Sci. Technol. 15 (1978), pp. 171-177.
Schiller et al., Thin Solid Films 64 (1979), pp. 455-467.

Affiliated with

Also associated with

Rating

Planar magnetron sputtering apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Planar magnetron sputtering apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Planar magnetron sputtering apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-758231