Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1993-07-13
1995-04-18
Nguyen, Nam
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
20429809, 20429816, 20419212, C23C 1434
Patent
active
054075513
ABSTRACT:
A planar magnetron sputtering device with improved target utilization and cooling capacity is provided. The device includes a magnet yoke as the main structure of the cathode body. The magnet yoke is made of low carbon steel which provides magnetic shunt and physical strength. The target is attached to a metal backing plate so that the side surface of the target is substantially flush with the side surface of the backing plate. Suitable magnets are adapted for producing a closed-loop magnetic field over the lower surface of the target. The magnets include an outer magnet that has an annular structure positioned around an inner elongated magnet. The outer magnets are positioned along the perimeter of the backing plate and small magnets are employed to create larger active target area. The magnet yoke also comprises extension structures which are positioned along the side surface of the target. These extensions shunt the magnetic field at the edges of the target. The planar magnetron demonstrates improved target utilization and deposits more uniform films.
REFERENCES:
patent: 3956093 (1976-05-01), McLeod
patent: 4166018 (1979-08-01), Chapin
patent: 4198283 (1980-04-01), Class et al.
patent: 4426264 (1984-01-01), Munz et al.
patent: 4515675 (1985-05-01), Kieser et al.
patent: 4572776 (1986-02-01), Aichert et al.
patent: 4657654 (1987-04-01), Mintz
patent: 4834860 (1989-05-01), Demaray et al.
patent: 4892633 (1990-01-01), Welty
patent: 4966677 (1990-10-01), Aichert et al.
Chapin, John S., "The Planar Magnetron, " Vacuum Technology, pp. 37-40, (Jan. 1974).
Kirs Milan R.
Sieck Peter A.
Trumbly Terry A.
Cassett Larry R.
Draegert David A.
Nguyen Nam
The BOC Group Inc.
LandOfFree
Planar magnetron sputtering apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Planar magnetron sputtering apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Planar magnetron sputtering apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-64691