Planar interconnects using compressible wire bundle contacts

Details Planar interconnects using compressible wire bundle contacts Planar interconnects using compressible wire bundle contacts

1999-09-14

2001-10-23

Lee, Benny (Department: 2817)

Wave transmission lines and networks

Coupling networks

With impedance matching

C333S260000

Reexamination Certificate

active

06307446

ABSTRACT:

TECHNICAL FIELD OF THE INVENTION
This invention relates to RF interconnect structures for providing interconnection between two conductors, and more particularly to techniques for providing elastic planar interconnects between two conductors.
BACKGROUND OF THE INVENTION
The existing industry standard for planar interconnects between two conductors is by gold wire or gold ribbon connection. Where any independent movement of the conductors can occur due to mechanical and/or environmental stresses, a loop in the interconnecting medium must be made to allow for stress relief. The amount of loop stress relief must be proportional to the amount of movement of the conductors. Unfortunately looping stress relief in high frequency RF interconnecting medium causes an impedance mismatch that results in poor VSWR and degradation of RF performance. Variability also occurs in forming the looping RF interconnection that further degrades RF performance. The act of assembling looping gold interconnects is typically a manual process that is above and beyond the other processes that are required to assemble a microwave integrated circuit.
In some instances it is not possible to form a reliable RF interconnection at high frequencies using conventional techniques. When this occurs costly mitigation steps must be taken which add to the overall unit cost.
SUMMARY OF THE INVENTION
A method for providing an RF interconnection between first and second planar conductors is described, which provides stress relief against mechanical and environment stresses. The method includes:
providing a first conductor and a second conductor in a generally coplanar relationship, the first conductor having a first connection portion, the second conductor having a second connection portion, and wherein the first connection portion is separated from the second connection portion;
providing a length of a compressible wire bundle having first and second end portions;
attaching the first end portion to the first connection portion of the first conductor; and
attaching the second end portion to the second connection portion of the second conductor.
In a typical application, the first and second conductors are disposed on separate substrates, in turn mounted to a package surface. The compressible wire bundle provides an elastic interconnection which provides stress relief against mechanical and environmental stresses to which the package is subjected.
According to another aspect of the invention, an RF circuit is described, and includes a first conductor and a second conductor disposed in a generally coplanar relationship, the first conductor having a first connection portion, the second conductor having a second connection portion, and wherein the first connection portion is separated from the second connection portion. An elastic RF interconnection is provided between the first and second conductors, the interconnection comprising an elastic conductor having first and second end portions, the first end portion attached to the first connection portion of the first conductor, the second end portion attached to the second connection portion of the second conductor.


REFERENCES:
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patent: 6028498 (2000-02-01), Bickford
patent: 256801 (1989-10-01), None
patent: 293001 (1989-11-01), None
Product Data Sheet for CIN ASPE Stacking Connector, Cinch Connectors, 7 pages, 1991.
Product Data Sheet for Gilbert GPO Interconnect System, Gilbert Engineering Co., Inc., 4 pages, 1992.

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