Planar dielectric line and integrated circuit using the same lin

Wave transmission lines and networks – Long lines – Waveguide type

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333248, 333249, H01P 300, H01P 316

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active

059865270

ABSTRACT:
A small and inexpensive planar dielectric line that can be easily connected to electronic parts, such as ICs, and has smaller conduction losses. The planar dielectric line includes a dielectric substrate having first and second surfaces opposedly facing each other. A first slot having a predetermined width is interposed between first and second electrodes on the first surface of the dielectric substrate. A second slot having the same width as the first slot is disposed between third and fourth electrodes on the second surface of the dielectric substrate. The first and second slots opposedly face each other. The permittivity and the thickness of the dielectric substrate are determined so that a planar electromagnetic wave can propagate in a propagation region of the substrate interposed between the first and second slots while being substantially totally reflected on the first surface of the substrate adjacent to the first slot and the second surface of the substrate near the second slot. When the permittivity and the thickness of the dielectric substrate are determined to meet the following conditions, 80% or more of the total electric field energy is confined within a region which is small enough to substantially eliminate interference with an adjacent line:
(relative permittivity of dielectric substrate).gtoreq.10 (thickness "t" of dielectric substrate).gtoreq.0.3 mm. When the relative permittivity is at least 18, 90% or more of the total electric field energy is confined.

REFERENCES:
patent: 2673962 (1954-03-01), Kock
patent: 4425549 (1984-01-01), Schwartz et al.
H.C.C. Fernandes et al., "Metallization Thickness In Bilateral and Unilateral Finlines", Int'l. Jrnl. of Infrared and Millimeter Waves, vol. 15, No. 6, pp. 1008, Line 14, 1009, Line 8, Jun. 6, 1994.
J.J. Lee, "Slotline Impedance", IEEE Transactions on MTT, vol. 39, No. 4, pp. 666-672, Apr. 1991.

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