Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Junction field effect transistor
Utility Patent
1998-02-26
2001-01-02
Meier, Stephen D. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Field effect device
Junction field effect transistor
C257S276000
Utility Patent
active
06169301
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a planar dielectric integrated circuit for use in a millimetric-wave band and a microwave band.
2. Description of the Related Art
In a millimetric-wave band and a microwave band, transmission lines have been often used which are constructed by forming a predetermined conductor on a dielectric substrate to form a waveguide, a coaxial line, a microstrip line, a coplanar line, a slot line, and the like. In particular, in a dielectric substrate having a transmission line formed thereon, since connection with electronic components, such as ICs, is easy, many attempts to form an integrated circuit by mounting electronic components onto a dielectric substrate have been made.
However, in the conventional microstrip line, coplanar line, slot line, and the like, since transmission loss is relatively large, these are not suitable for a circuit requiring, particularly, a low transmission loss. Therefore, the applicant of the present invention submitted the invention concerning a planar dielectric line and an integrated circuit, which solve these problems, in Japanese laid-open Patent Application No. Hei-08-265007.
Moreover, since the input/output sections of electronic components, such as semiconductor devices, and the planar dielectric line generally differ in the electromagnetic-field distribution, merely mounting electronic components to the planar dielectric line causes the conversion loss to increase greatly. Further, if electronic components are only mounted to one surface of the dielectric plate, no connection between the electromagnetic field on the back surface thereof and the electronic components is made, this point also leading to an increase in the conversion loss. Mounting electronic components to both surfaces of the dielectric plate eliminates the latter problem; however, this results in a decrease in the characteristic reproducibility (yield) due to the characteristic variations of the electronic components, an increase in loss, and an increase in the material and mounting costs.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a planar dielectric integrated circuit such that energy conversion loss between the planar dielectric line and electronic components is small, and impedance matching between them is obtained easily.
According to the aspect of the present invention, to perform integration by reducing a signal loss in the coupled section of the planar dielectric line and the electronic components and while maintaining a low loss characteristic, which is a feature of the planar dielectric line, a planar dielectric line is constructed such that two conductors are provided at a fixed distance on a first main surface of a dielectric plate to provide a first slot, two conductors are provided at a fixed distance on a second main surface of a dielectric plate to provide a second slot which opposes the first slot, with the area sandwiched between the first slot and the second slot of the dielectric plate being formed as a plane-wave propagation area. A coplanar line is provided in the end portion or at the midpoint of the planar dielectric line, a line-conversion conductor pattern is provided which projects from the center conductor of the coplanar line in a direction at right angles to the planar dielectric line, and electronic components are disposed in such a manner as to be extended over the coplanar line.
With this construction, an LSM-mode signal which propagates through the planar dielectric line is coupled to the line-conversion conductor pattern which projects in a direction at right angles to the planar dielectric line, and is converted into the propagation mode of the coplanar line. And a signal is input to the electronic components disposed in such a manner as to extend over this coplanar line. Conversely, when a signal is output from the electronic components, the signal is propagated in the propagation mode of the coplanar line and, as a result of the coupling between the line-conversion conductor pattern which projects in a direction at right angles to the planar dielectric line and the planar dielectric line, the signal propagates through the planar dielectric line in the LSM mode.
Preferably, two planar dielectric lines are constructed such that a first slot is provided by disposing two electrodes at fixed intervals on a first main surface of the dielectric plate, a second slot, which opposes the first slot, is provided by disposing two electrodes at fixed intervals on a second main surface of the dielectric plate, with the area sandwiched by the first slot and the second slot of the conductor plate being formed as a propagation area of a plane wave. A first line-conversion conductor pattern which is connected to the electromagnetic field of a slot line and the first planar dielectric line is provided at one end portion of the slot line, and a coplanar line is provided in the vicinity of the other end portion of the slot line. A second line-conversion conductor pattern is provided which projects from the center conductor at the end portion of the coplanar line in a direction at right angles to the second planar dielectric line. The electronic components are disposed in such a manner as to extend over the coplanar line and the slot line.
With this construction, the LSM-mode signal which propagates through the first planar dielectric line is coupled to the first line-conversion conductor pattern, is converted into a TE mode, propagates through the slot line, and is input to the electronic components. The LSM-mode signal which propagates through the second planar dielectric line is coupled to the second line-conversion conductor pattern, is converted into the propagation mode of the coplanar line, and is input to the electronic component. In response, the electronic component performs a signal processing, such as synthesizing two signals input from the first and second planar dielectric lines. When, for example, this electronic component is a mixer FET (field-effect transistor) or a mixer diode, by inputting an RF signal and a Lo signal from the first and second planar dielectric lines, respectively, an IF signal can be taken from the bias voltage supply line to the external source.
Preferably, a short stub which is used to obtain impedance matching between the line-conversion conductor pattern and the electronic components is provided at the midpoint of the slot line or the coplanar line. As a result, impedance matching is obtained between the line-conversion conductor pattern and the electronic components, and the loss in the connection section of the slot line and the electronic components is reduced.
Further, preferably, an impedance matching circuit is provided between the line-conversion conductor pattern and the slot line or the coplanar line. As a result, impedance matching is obtained between the line-conversion conductor pattern and the planar dielectric line and the slot line or the coplanar line, thereby suppressing unwanted reflection and reducing the transmission loss caused by line conversion.
The above and further objects, aspects and novel features of the invention will become more apparent from the following detailed description when read in connection with the accompanying drawings.
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patent: 5532506 (1996-07-01), Tserns
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patent: 0735604 (1996-10-01), None
patent: 6-29376 (1994-02-01), None
Artuzi W.A. et al: “A HEMT Amplifier For Nonradiative Dielectric Waveguide Integrated Circuits”, IEICE Transactions, vol. E74, No. 5, May 1991, pp. 1185-1190.
Pehl, E: “Microwave Lines And Their Applications”, Materials Science and Engineering B, vol. 1,No. 1, Jun. 10, 1986, pp. 1-16.
Liang Han et al: “An Integrated Transition of Microstrip to Nonradiative Dielectric Waveguide for Microwave and Millimeter-Wave Circuits:”, IEEE Transactions on Microwave Theory and Techniques, vol. 44, No. 7, PART 01, Jul. 1, 1996, pp. 1091-1096.
Ishikawa Yohei
Kajikawa Takehisa
Sakamoto Koichi
Yamashita Sadao
Meier Stephen D.
Murata Manufacturing Co. Ltd.
Ostrolenk Faber Gerb & Soffen, LLP
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