Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1991-03-04
1992-04-21
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
174252, H01R 909
Patent
active
051063085
ABSTRACT:
A planer contact grid array connector features a selectively ceramic coated metal substrate in combination with ceramic thick film and/or multi-layer thin film circuitry and contacts of various configurations which may be affixed to or incorporated in mating connector halves. Planer contact array connectors of the type described have coaxial connection features, increased power handling capability and improved means for effecting gas-tight contact between mating connector halves. Additionally, the connectors are more reliable, lighter and more rugged than currently available connectors and have the capability of incorporating integral ceramic thick film components such as capacitors and resistors for filtering, impedance control and signal/power conditioning, as the case may be.
REFERENCES:
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patent: 4116517 (1978-09-01), Selvin et al.
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patent: 4791239 (1988-12-01), Shirahata et al.
patent: 4866571 (1989-09-01), Butt
patent: 4914260 (1990-04-01), Suzuki et al.
patent: 4963697 (1990-10-01), Peterson et al.
Gollomp Bernard P.
Kurtz Bruce E.
Abrams Neil
Allied-Signal Inc.
Massung Howard G.
Walsh Robert A.
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