Planar chip-level power combiner

Details Planar chip-level power combiner Planar chip-level power combiner

1980-12-05

1983-05-31

Mullins, James B.

Amplifiers

With semiconductor amplifying device

Including field effect transistor

330286, 330295, 333128, 333136, 333238, 333246, H03F 360

Patent

active

043863248

ABSTRACT:
A chip-level power combiner comprises plural amplifier devices, a power divider, and a power combiner. The power divider and the power combiner are disposed in mirror-image fashion. Each divider/combiner comprises a first divider/combiner section having plural branch transmission lines cascading from/to a main transmission line, and a second divider/combiner section having plural feeder transmission lines cascading from/to each branch of the transmission line. Each of the branch and feeder transmission lines has an isolation resistor interposed between adjacent lines, and the feeder transmission lines are tapered.

REFERENCES:
patent: 3963993 (1976-06-01), Hoffman et al.
patent: 4129839 (1978-12-01), Galani et al.
patent: 4311965 (1982-01-01), Jones
Sukhova et al., "Power Dividers Constructed from Nonhomogeneous Lines", Radio Engineering and Electron Physics, vol. 22, No. 1, pp. 31-36, Jan. 1977.

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