Planar bond pad design and method of making the same

Details Planar bond pad design and method of making the same Planar bond pad design and method of making the same

2006-05-30

2006-05-30

Clark, S. V. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

C257S781000

Reexamination Certificate

active

07053490

ABSTRACT:
Techniques for an integrated circuit device with planar bond pads are provided. A metal layer region is formed on a substrate. The integrated circuit device also includes a passivation layer that has an opening formed around the metal layer region. The passivation layer and a top surface of the metal layer region defines a continuous planar surface. An under bump metallurgy structure, sized and positioned to completely overlay the top surface of the metal layer region, is coupled to the continuous planar surface. The under bump metallurgy structure is coupled to a bump termination electrode. Preferably, a top surface of the bump termination electrode has a maximum surface nonuniformity of less than about 1 micron.

REFERENCES:
patent: 5587336 (1996-12-01), Wang et al.
patent: 6316813 (2001-11-01), Ohmi et al.
patent: 6362090 (2002-03-01), Paik et al.
patent: 6448171 (2002-09-01), Wang et al.
patent: 6501185 (2002-12-01), Chow et al.
patent: 6597069 (2003-07-01), Degani et al.
patent: 6759751 (2004-07-01), Sinha
patent: 6853076 (2005-02-01), Datta et al.
patent: 6958546 (2005-10-01), Fan et al.
patent: 2004/0159944 (2004-08-01), Datta et al.

Affiliated with

Also associated with

Rating

Planar bond pad design and method of making the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Planar bond pad design and method of making the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Planar bond pad design and method of making the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3642736