Planar beam dump

Metal deforming – By extruding through orifice – Expressing non-uniform cross-section or non-linear product

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C072S253100, C072S467000

Reexamination Certificate

active

07971465

ABSTRACT:
In one embodiment, a device for capturing radiation includes: a panel defining a plurality of double wedge chambers, wherein each double wedge chamber includes a first wedge-shaped chamber that tapers into an opening for a second wedge-shaped chamber, and wherein a longitudinal axis of the first wedge-shaped chamber is not collinear with a longitudinal axis of the second wedge-shaped chamber.

REFERENCES:
patent: 2341749 (1944-02-01), Webb
patent: 2716805 (1955-09-01), Reed
patent: 2748934 (1956-06-01), Wheeler
patent: 2872037 (1959-02-01), Ausel et al.
patent: 2950817 (1960-08-01), Graham
patent: 2968835 (1961-01-01), Weston, Jr. et al.
patent: 3286502 (1966-11-01), Cogan
patent: 3585834 (1971-06-01), De Bruyn et al.
patent: 4068517 (1978-01-01), Fuchs, Jr.
patent: 4187711 (1980-02-01), Lavochkin et al.
patent: 4208898 (1980-06-01), Ames et al.
patent: 4571983 (1986-02-01), Sanborn et al.
patent: 6176064 (2001-01-01), Janelle
patent: 55-120414 (1980-09-01), None
patent: 4-41014 (1992-02-01), None
patent: 6-285539 (1994-10-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Planar beam dump does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Planar beam dump, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Planar beam dump will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2696896

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.