Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2011-01-04
2011-01-04
Nguyen, Cuong Q (Department: 2811)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S128000
Reexamination Certificate
active
07863089
ABSTRACT:
A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a plurality of connectors, a plurality of memory devices coupled to the card via a first portion of the plurality of couplings, and at least one hub chip coupled to the card via a second portion of the plurality of couplings. Each of the plurality of couplings is connected to an associated one of the plurality of connectors.
REFERENCES:
patent: 7061784 (2006-06-01), Jakobs et al.
patent: 7212408 (2007-05-01), Noble
patent: 2006/0095629 (2006-05-01), Gower et al.
patent: 11-67365 (1989-07-01), None
patent: 2004-79377 (2004-03-01), None
patent: WO 2004/015822 (2004-02-01), None
Coteus Paul
Gower Kevin C.
Hall Shawn Anthony
Hougham Gareth Geoffrey
Pearson Dale J.
Harrington & Smith
International Business Machines - Corporation
Nguyen Cuong Q
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