Placement of electronic components

Details Placement of electronic components Placement of electronic components

2005-04-12

2005-04-12

Von Buhr, Maria N. (Department: 2125)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

Reexamination Certificate

active

06879869

ABSTRACT:
An electronic component placement machine is disclosed that includes a series of feeders adapted to supply discrete electronic components for subsequent placement onto a destination circuit board; at least one data module coupled to each feeder, each data module comprising a memory storage device; at least one communications module coupled to each feeder, each communications module comprising a data module-transceiver coupled to a memory storage device of the associated data module; a pick head, movable between selected feeders for sequentially picking the discrete electronic components from a respective feeders for subsequent placement onto a destination circuit board; and a pick head-transceiver secured to the pick head for movement therewith between feeders, the pick head-transceiver arranged to communicate over a duplex communications channel with a data module-transceiver of a selected feeder when the pick head is positioned to pick from the selected feeder.

REFERENCES:
patent: 3968755 (1976-07-01), Lester
patent: 4175654 (1979-11-01), Lodge
patent: 4242632 (1980-12-01), Irvin
patent: 4426619 (1984-01-01), Demand
patent: 4527326 (1985-07-01), Kohno et al.
patent: 4684884 (1987-08-01), Soderlund
patent: 4939469 (1990-07-01), Ludwig et al.
patent: 5024532 (1991-06-01), Rall
patent: 5145047 (1992-09-01), Terracol et al.
patent: 5155888 (1992-10-01), Lau
patent: 5157617 (1992-10-01), Ramsey
patent: 5283943 (1994-02-01), Aguayo et al.
patent: 5434737 (1995-07-01), Miura
patent: 5443534 (1995-08-01), Vinciarelli et al.
patent: 5450018 (1995-09-01), Rieser et al.
patent: 5455409 (1995-10-01), Smith et al.
patent: 5455894 (1995-10-01), Conboy et al.
patent: 5515600 (1996-05-01), Iwasaki et al.
patent: 5553376 (1996-09-01), Solanki et al.
patent: 5567927 (1996-10-01), Kahn et al.
patent: 5606264 (1997-02-01), Licari et al.
patent: 5659440 (1997-08-01), Acosta et al.
patent: 5713125 (1998-02-01), Watanabe et al.
patent: 5764073 (1998-06-01), Sadamatsu
patent: 5838574 (1998-11-01), Olson et al.
patent: 5844593 (1998-12-01), Proffitt et al.
patent: 5867809 (1999-02-01), Soga et al.
patent: 6027019 (2000-02-01), Kou
patent: 6031242 (2000-02-01), Hudson
patent: 6045653 (2000-04-01), Johnson
patent: 6113262 (2000-09-01), Purola et al.
patent: 6505093 (2003-01-01), Thatcher et al.
patent: 6530517 (2003-03-01), Kou
patent: 6618629 (2003-09-01), Martens et al.
patent: 6675056 (2004-01-01), Black et al.
patent: 6816751 (2004-11-01), Alice et al.
patent: 20030030429 (2003-02-01), Kou
patent: 20030102367 (2003-06-01), Monette et al.
patent: 20030135296 (2003-07-01), Martens et al.
patent: 2436439 (1976-02-01), None
patent: 0123972 (1984-11-01), None
patent: 0476577 (1992-03-01), None
patent: 1494407 (1977-12-01), None
patent: 6-6076 (1994-01-01), None
patent: 6-6077 (1994-01-01), None
patent: 6-6098 (1994-01-01), None
patent: 6-042986 (1994-02-01), None
“Joint Industry Standard”, IPC/JEDEC J-STD-033, Apr. 1999.
“Microchip PIC12C67X”, © 1999 Microchip Technology Inc.
Awtrey et al., “A1-Wire Humidity Sensor”, Sensors The Journal of Applied Sensing Technology, no date.
“Dallas Semiconductor, DS2438 Smart Battery Monitor”, www.dalsemi.com, Apr. 10, 2001, pp 1-29.
“Humidity Sensors Relative Humidity”, Honeywell HIH Series, pp 99, 100, no date.
“Cytherm Temperature Data Logger Key”, Dynasys Technologies Inc., no date.

Affiliated with

Also associated with

Rating

Placement of electronic components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Placement of electronic components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Placement of electronic components will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3407000