Placement of an integrated circuit

Details Placement of an integrated circuit Placement of an integrated circuit

2008-08-21

2010-12-14

Lindsay, Jr., Walter L (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S106000, C438S125000, C438S129000, C257SE21499, C257SE21511, C257SE21705

Reexamination Certificate

active

07851255

ABSTRACT:
Disclosed herein is a method of positioning and placing an integrated circuit on a printed circuit board. The integrated circuit comprises first geometrical elements. The first geometrical elements are of one or more predefined shapes and are located on one or more predefined surfaces of the integrated circuit. The printed circuit board comprises second geometrical elements. The second geometrical elements are shaped to accommodate the first geometrical elements. The first geometrical elements are designed to fit into the second geometrical elements. The first geometrical elements are positioned and placed over the second geometrical elements. The first geometrical elements come in contact with the second geometrical elements at two or more points. The positioning and placement of the first geometrical elements over the second geometrical elements limits displacement of connections of the integrated circuit from the printed circuit board.

REFERENCES:
patent: 2001/0016435 (2001-08-01), Fujimura
patent: 2003/0111727 (2003-06-01), Kurusu
patent: 2004/0169275 (2004-09-01), Danvir et al.
patent: 2006/0118971 (2006-06-01), Gracias
patent: 58121654 (1983-07-01), None
patent: 62018722 (1987-01-01), None

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