Placement of absorbing material in a semiconductor device

Details Placement of absorbing material in a semiconductor device Placement of absorbing material in a semiconductor device

2006-03-17

2008-10-28

Lindsay, Jr., Walter L (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S015000, C438S106000, C257SE21499, C257SE23001, C257SE33056

Reexamination Certificate

active

07442576

ABSTRACT:
A semiconductor device is provided that includes a hermetically sealed housing having a top member and a bottom member. A semiconductor die is enclosed within the housing and absorbing material is positioned under the semiconductor die.

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