Placement mechanism

Details Placement mechanism Placement mechanism

1985-12-30

1987-03-03

Goldberg, Howard N.

Metal working

Means to assemble or disassemble

Means to assemble electrical device

29740, B23P 1900

Patent

active

046464328

ABSTRACT:
A placement mechanism for vertically displacing a micro-electronic component to place the component on a printed circuit board. The mechanism has a spindle that is displaceable on a vertical axis and rotatable on the vertical axis to align the component leads with the lands of the circuit on the board. The spindle carries a placement rod in communication with a vacuum source to enable the component to be retrieved and placed on the board. The placement rod has a resilient interconnection with the spindle to allow for varying board heights and to buffer the impact of the placement of the component on the board.

REFERENCES:
patent: 2661644 (1953-08-01), Hultquist
patent: 3861014 (1975-01-01), Summerlin
patent: 4151945 (1979-05-01), Ragard et al.
patent: 4174566 (1979-11-01), Smith
patent: 4206543 (1980-06-01), Chisholm
patent: 4515507 (1985-05-01), Asai et al.
patent: 4527327 (1985-07-01), Van Deuren
IBM Technical Disclosure Bulletin, vol. 24, No. 2, Jul. 1981.

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