Food or edible material: processes – compositions – and products – Surface coated – fluid encapsulated – laminated solid... – Isolated whole seed – bean or nut – or material derived therefrom
Patent
1997-06-17
1999-10-05
Tran, Lien
Food or edible material: processes, compositions, and products
Surface coated, fluid encapsulated, laminated solid...
Isolated whole seed, bean or nut, or material derived therefrom
426 76, 426144, 426275, 426496, A21D 1300
Patent
active
059620501
ABSTRACT:
A compound pizza arrangement includes an inner shell section and an outer shell section. A gap is formed between the outer edge of the inner shell section and an inner edge of the outer shell section, to prevent the shell sections from contacting each other when the shell sections expand during baking. The inner and outer shell sections function to increase the overall length of the exposed shell edge, and provide two distinct shell sections for receiving toppings or other ingredients. A die is utilized to separate the shell sections from each other and form the space therebetween.
REFERENCES:
patent: 2332595 (1943-10-01), Paquette
patent: 2478571 (1949-08-01), Creider
patent: 2499309 (1950-02-01), Harris
patent: 2779097 (1957-01-01), Frazier
patent: 3531863 (1970-10-01), Sandborn et al.
patent: 3864071 (1975-02-01), La Monica
patent: 4251554 (1981-02-01), Baisden
patent: 5074778 (1991-12-01), Betts, Jr. et al.
patent: 5417150 (1995-05-01), Kordic
patent: 5508049 (1996-04-01), Kordic
patent: 5514402 (1996-05-01), Williams
patent: 5830519 (1998-11-01), Telfer et al.
LandOfFree
Pizza-type product having an increased length of exposed crust e does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Pizza-type product having an increased length of exposed crust e, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pizza-type product having an increased length of exposed crust e will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1168827