Pinned photodiode integrated with trench isolation and...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Charge transfer device

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S461000

Reexamination Certificate

active

07145190

ABSTRACT:
A photo sensor with pinned photodiode structure integrated with a trench isolation structure. The photo sensor includes a substrate of a first conductivity type, at least one trench in the substrate, at least one doped region of the first conductivity type, and at least one doped region of a second conductivity type. Each doped region of the first conductivity type is beneath a corresponding trench. Each doped region of the second conductivity type is sandwiched between the corresponding doped region and the substrate of the first conductivity type. No edge of any doped region of the first or second conductivity type extends to the trench corners. A method of fabricating the photo sensor is also provided.

REFERENCES:
patent: 6329679 (2001-12-01), Park
patent: 2005/0062078 (2005-03-01), Han
patent: 2005/0133837 (2005-06-01), Hsu et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Pinned photodiode integrated with trench isolation and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pinned photodiode integrated with trench isolation and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pinned photodiode integrated with trench isolation and... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3683522

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.