Pinned module

Details Pinned module Pinned module

1994-01-21

1996-08-20

Sparks, Donald A.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361744, 361784, 361773, 361774, 361776, 361789, 361790, 439 74, 439 75, 439 82, 439 84, 439751, H01R 2368, H01R 909

Patent

active

055484867

ABSTRACT:
An electrical connection pin blank having at least one compliant section is affixed to a first circuit board by compressive deformation in such a way that the compliant section of the pin blank projects outwardly from the surface of the first circuit board. The end of the pin projecting from the first circuit board is then inserted into a corresponding opening in a second circuit board and the two boards brought together until the second circuit board is firmly affixed to the complaint section of the pin by compliant pin connection.

REFERENCES:
patent: 2611010 (1952-09-01), Sass et al.
patent: 2979600 (1961-04-01), Rangabe
patent: 3281923 (1966-11-01), Best et al.
patent: 3541496 (1970-11-01), Castellani
patent: 3545080 (1970-12-01), Evans
patent: 3880486 (1975-04-01), Avakian
patent: 4034468 (1977-07-01), Koopman
patent: 4066326 (1978-01-01), Lovendusky
patent: 4072816 (1978-02-01), Gedney et al.
patent: 4082394 (1978-04-01), Gedney et al.
patent: 4120843 (1978-10-01), Ameen et al.
patent: 4191938 (1980-03-01), Gow, 3rd et al.
patent: 4202007 (1980-05-01), Dougherty et al.
patent: 4233620 (1980-11-01), Darrow et al.
patent: 4265775 (1981-05-01), Aakalu et al.
patent: 4274124 (1981-06-01), Feinberg et al.
patent: 4291364 (1981-09-01), Andros et al.
patent: 4415025 (1983-11-01), Horvath
patent: 4446505 (1984-05-01), Long et al.
patent: 4550493 (1985-11-01), Darrow et al.
patent: 4601424 (1986-07-01), Adwalpalker et al.
patent: 4676426 (1987-06-01), Darrow et al.
patent: 4682270 (1987-07-01), Whitehead et al.
patent: 4690833 (1987-09-01), Donson et al.
patent: 4724472 (1988-02-01), Sugimoto et al.
patent: 4741100 (1988-05-01), Pierson
patent: 4764848 (1988-08-01), Simpson et al.
patent: 4780371 (1988-10-01), Joseph et al.
patent: 4791075 (1988-12-01), Lin
patent: 4803595 (1989-02-01), Kraus et al.
patent: 4813130 (1989-03-01), Fey et al.
patent: 4821142 (1989-04-01), Ushifusa et al.
patent: 4825284 (1989-04-01), Soga et al.
patent: 4827328 (1989-05-01), Ozawa et al.
patent: 4878861 (1989-11-01), Kendall et al.
patent: 4883744 (1989-11-01), Feilchenfeld et al.
patent: 4889496 (1989-12-01), Neidich
patent: 4916259 (1990-04-01), Charsky et al.
patent: 4969259 (1990-11-01), Macek et al.
patent: 4988646 (1991-01-01), Mukherjee
patent: 5002507 (1991-03-01), Sitzler
patent: 5048178 (1991-09-01), Bindra et al.
patent: 5050296 (1991-09-01), Emerick et al.
patent: 5065227 (1991-11-01), Frankeny et al.
patent: 5082460 (1992-01-01), Legrady
patent: 5102352 (1992-04-01), Arisaka
patent: 5110664 (1992-05-01), Nakanishi et al.
patent: 5159535 (1992-10-01), Desai et al.
patent: 5257165 (1993-10-01), Chiang
IBM Disclosure Bulletin "Weld Pin Through-hole Connection for Printed-Circuit Boards" by C. J. Aug, vol. 15, No. 8, Jan. 1973 (pp. 2492).
Mill-Max MFG. Corp. "Printed Circuit Pins" Pub. Date 1985.
Berg Electronics Brochure "Bery Compliant Press-Fit Edge Card Connector" Data Sheet 7020, Dec. 1982.
DuPont Conpliant Press-Fit Pins ".64 mm (0.025in) Square Pins Hold Fast Without Solder; Allow Wide Hole Tolerance" Data Sheet 7001/7010, Jun. 1985.
IBM Disclosure Bulletin "Segmented Modular Complinant Pin Carrier For Large Pinless Headers" vol. 36, No. 04, Apr. 1993
Research Disclosure, May 1990, No. 313, Kenneth Mason Publications Ltd., England.
IBM Technical Disclosure Bulletin, vol. 18, No. 5, pp. 1440-1441.
IBM Technical Disclosure Bulletin, vol. 20, No. 8, pp. 3090-3091.
IBM Techincal Disclosure Bulleting, vol. 33, No. 2, pp. 15-16.
IBM Technical Disclosure Bulletin, vol. 10, No. 12, May 1968, pp. 1977-1968.
IBM Technical Disclosure Bulletin, vol. 27, No. 3, Aug. 1984, pp. 1499-1501.
IBM Technical Disclosure Bulletin, vol. 21, No. 12, May 1979, pp. 4796-4797.
Over Molded Pad Array Carrier (OMPAC), "A New Kid on the Block", Jim Sloan et al., Rev. Feb. 10, 1993. Motorola, Inc.
IBM Technical Disclosure Bulletin, vol. 15, No. 8, Jan. 1973, p. 2492.

Affiliated with

Also associated with

Rating

Pinned module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pinned module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pinned module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2335148