Pinned electronic package with strengthened conductive pad

Details Pinned electronic package with strengthened conductive pad Pinned electronic package with strengthened conductive pad

2006-08-08

2006-08-08

Cuneo, Kamand (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C029S843000

Reexamination Certificate

active

07087846

ABSTRACT:
An electronic package and information handling system utilizing same wherein the package substrate includes an internally conductive layer coupled to an external pad to provide reinforced adhesion of the pad to the substrate to substantially prevent cracking, separation, etc. of the pad when the pad has a pin bonded thereto and the package is coupled to an external substrate (e.g., printed circuit board). The reinforced adhesion also prevents pad separation, etc. during periods of package handling, manufacture, etc.

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