Pinned ceramic substrate

Details Pinned ceramic substrate Pinned ceramic substrate

1981-04-10

1984-02-28

Hunt, Brooks H.

Powder metallurgy processes

Powder metallurgy processes with heating or sintering

Making composite or hollow article

419 36, 419 40, 29842, 29844, 29852, 29845, 29853, 29875, 29884, B22F 300

Patent

active

044341342

ABSTRACT:
Ceramic substrates are pinned using powdered metallurgy pins formed in situ on the substrate.

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"Pinning Technique for Ceramic Module", J. R. Lynch, IBM Technical Disclosure Bulletin, vol. 14, No. 1, Jun. 1971, pp. 174-175.
"Low-Stress Pin Insertion", R. J. Modlo et al., IBM Technical Disclosure Bulletin, vol. 2, No. 8B, Jan. 1980, pp. 3649-3650.

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