Pinned ceramic chip carrier

Details Pinned ceramic chip carrier Pinned ceramic chip carrier

1993-06-17

1994-02-22

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 522, 257697, 437209, H01L 2302

Patent

active

052889440

ABSTRACT:
A ceramic chip carrier is disclosed which preferably includes a ceramic substrate having a circuitized surface, at least one semiconductor chip mounted on the circuitized surface, and at least one pin which is mechanically and electrically connected to a contact pad on the circuitized surface. Each mechanical/electrical connection between a pin and a contact pad includes a conventional solder connection. In addition, each such solder connection is at least partially encapsulated in a material, including an epoxy resin, which is chosen in relation to the solder connection to enable the solder connection to withstand a standard thermal fatigue test.

REFERENCES:
patent: 4338621 (1982-07-01), Braun
patent: 4513355 (1985-04-01), Schroeder et al.
patent: 5041396 (1991-08-01), Valero

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