Geometrical instruments
Patent
1984-04-27
1985-10-22
Abrams, Neil
Geometrical instruments
29848, 339 61M, H01R 2372
Patent
active
045484511
ABSTRACT:
A pinless connector interposer for making densely populated, inexpensive, simple, reliable, self-wiping connections between components used in semiconductor packaging such as semiconductor carrying substrates, flexible and rigid printed circuit boards and cards. The connector interposer comprises an elastomeric base member in which deformable protrusions are formed on both the top and bottom surface of the base member, wherein the protrusions correspond to contact pads of semiconductor packaging components. An electrically conductive metal coated flexible overlay is bonded to the base member, forming electrically conductive tab elements, enabling a multitude of connections to be made to a semiconductor package. The connections can be accommodated on centers as low as 0.025 inches, despite the non-planarity that may exist between the packaging components of a system.
REFERENCES:
patent: 3924915 (1975-12-01), Conrad
Benarr Garry M.
Burns Terry A.
Walker William J.
Abrams Neil
International Business Machines - Corporation
Stoffel Wolmar J.
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