Pin substrate and package

Details Pin substrate and package Pin substrate and package

2008-06-23

2010-06-29

Pham, Thanh V (Department: 2894)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Substrate dicing

C438S025000, C438S026000, C438S055000, C438S058000, C438S064000, C438S143000

Reexamination Certificate

active

07745244

ABSTRACT:
A semiconductor die package. Embodiments of the package can include a substrate with solid conductive pins disposed throughout. A semiconductor die can be attached to a surface of the substrate. Electrical connection to the semiconductor die can be provided by the solid conductive pins.

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patent: 2004/0164386 (2004-08-01), Joshi
patent: 2006/0170101 (2006-08-01), Kaizuka
patent: 2008/0296752 (2008-12-01), Nakajima
patent: 2009/0063092 (2009-03-01), Pierce et al.

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