Pin substrate and package

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Substrate dicing

Reexamination Certificate

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Details

C438S025000, C438S026000, C438S055000, C438S058000, C438S064000, C438S143000

Reexamination Certificate

active

07745244

ABSTRACT:
A semiconductor die package. Embodiments of the package can include a substrate with solid conductive pins disposed throughout. A semiconductor die can be attached to a surface of the substrate. Electrical connection to the semiconductor die can be provided by the solid conductive pins.

REFERENCES:
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patent: 6188391 (2001-02-01), Seely et al.
patent: 6617680 (2003-09-01), Chien-Chih et al.
patent: 6645791 (2003-11-01), Noquil et al.
patent: 7023077 (2006-04-01), Madrid
patent: 7259457 (2007-08-01), Zhang et al.
patent: 7316063 (2008-01-01), Farnworth et al.
patent: 2004/0164386 (2004-08-01), Joshi
patent: 2006/0170101 (2006-08-01), Kaizuka
patent: 2008/0296752 (2008-12-01), Nakajima
patent: 2009/0063092 (2009-03-01), Pierce et al.

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