Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Substrate dicing
Reexamination Certificate
2008-06-23
2010-06-29
Pham, Thanh V (Department: 2894)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Substrate dicing
C438S025000, C438S026000, C438S055000, C438S058000, C438S064000, C438S143000
Reexamination Certificate
active
07745244
ABSTRACT:
A semiconductor die package. Embodiments of the package can include a substrate with solid conductive pins disposed throughout. A semiconductor die can be attached to a surface of the substrate. Electrical connection to the semiconductor die can be provided by the solid conductive pins.
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Liu Yong
Liu Yumin
Qian Qiuxiao
Yuan Zhongfa
Fairchild Semiconductor Corporation
Payen Marvin
Pham Thanh V
Townsend and Townsend / and Crew LLP
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