Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1985-06-11
1986-11-25
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
156643, 156646, 204298, 269 53, B44C 122, C03C 1500, H01L 21306, C23F 102
Patent
active
046247289
ABSTRACT:
A wafer is supported on pins within a plasma reactor, allowing the plasma to act on both sides of the wafer. Various processes are disclosed for pins-up and pins-down condition. If conductive pins are used, they are preferably flattened. The wafer is preferably biased negatively with respect to the plasma.
REFERENCES:
patent: 4547247 (1985-10-01), Warenback et al.
patent: 4551192 (1985-11-01), DiMilia et al.
Bithell Roger M.
Slomowitz Harry
Powell William A.
Tegal Corporation
Wille Paul F.
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