Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2009-08-04
2010-06-08
Nguyen, Khiem (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S059000
Reexamination Certificate
active
07731506
ABSTRACT:
A pin layout of a golden finger for FPC is disclosed, which comprises: a substrate; a first conductive layer, having a plurality of first routings; a second conductive layer, having a plurality of second routings; and a plurality of conductive members; wherein the first and the second conductive layers are formed respectively on the two opposite sides of the substrate in a manner that each first routing is electrically connected to its corresponding first pin, while disposing a plurality of second pins, without contacting to the first pins and the first routings, on the side of the substrate where the first conductive layer is disposed for corresponding each of the second pins to the extensions of the plural second routings; and the plural conductive members are disposed forming electric connections between the second routings and the second pins in respective.
REFERENCES:
patent: 5573409 (1996-11-01), Shiley et al.
patent: 6802721 (2004-10-01), Sanada et al.
patent: 7484967 (2009-02-01), Ichino et al.
Lo Chin-Wen
Wang Yueh-Fang
King Justin
Nguyen Khiem
Wintek Corporation
WPAT, PC
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