1989-02-27
1992-04-21
Hille, Rolf
357 80, H01L 2312
Patent
active
051073293
ABSTRACT:
A semiconductor device of pin-grid array (PGA) type, which is adapted for surface-mounting on a printed circuit board, has lead pins arranged in a grid and standing perpendicularly on a base of the semiconductor device. In addition, a few pins are provided which are longer than said lead pins in said grid. When the device is placed on the printed circuit board for mounting, the longer pins are inserted into through-holes which are respectively formed in the printed circuit board to correspond to the position of the longer pins of the device. Thus, the tip of the lead pins are accurately positioned on the top of lands on the printed circuit board, respectively, and the lead pins do not get out of position during the mounting operation.
REFERENCES:
patent: 4724472 (1988-02-01), Sugimoto et al.
Akasaki Hiroshi
Okinaga Takayuki
Otsuka Kanji
Clark S. V.
Hille Rolf
Hitachi , Ltd.
Hitachi VLSI Engineering Corp.
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