Pin grid array package with pin through plating

Details Pin grid array package with pin through plating Pin grid array package with pin through plating

1991-10-11

1994-08-30

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

118620, 361736, 361760, 174260, H01L 2302

Patent

active

053429923

ABSTRACT:
The present invention provides a method and an apparatus for manufacturing a pin grid array package assembly. According to this invention, the leads of the pin grid array package assembly are removably inserted into an electrically conductive plate containing detachable pin-clasp contacts. The plate clamps onto the ends of the leads, thereby forming a common electrical contact for the electroplating process. After the electroplating process has been completed and prior to shipping the package, the plate is detached without requiring the step of cutting ends of the leads from the plate.

REFERENCES:
patent: 3487350 (1969-12-01), Hammell
patent: 5061989 (1991-10-01), Yen et al.

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