Pin grid array package substrate including pins having...

Details Pin grid array package substrate including pins having... Pin grid array package substrate including pins having...

2007-06-05

2009-02-03

Hyeon, Hae Moon (Department: 2839)

Electrical connectors

Metallic connector or contact having part permanently...

Adapted to be secured to conductor formed on printed circuit...

C439S083000

Reexamination Certificate

active

07485017

ABSTRACT:
A microelectronic package substrate and an electrically conductive pin. The substrates includes: a die-side surface adapted to receive a die thereon; a printed circuit board (PCB)-side surface adapted to be mechanically and electrically bonded to a PCB; an array of land pads on the PCB-side surface, the land pads defining anchoring recesses therein; an array of electrically conductive pins electrically and mechanically bonded to respective ones of the land pads, the pins having anchoring elements thereon mated with corresponding ones of the anchoring recesses of the land pads, the anchoring elements and anchoring recesses being configured such that a mating thereof inhibits a tilting of the pins on the land pads; and a plurality of pin-attach solder joints mechanically and electrically bonding the pins to corresponding ones of the land pads.

REFERENCES:
patent: 5410452 (1995-04-01), Sinclair et al.
patent: 6049039 (2000-04-01), Fushimi
patent: 6270362 (2001-08-01), Guran et al.
patent: 6359332 (2002-03-01), Shiraishi
patent: 6623283 (2003-09-01), Torigian et al.
patent: 6896526 (2005-05-01), Pitzele
patent: 7118425 (2006-10-01), Chen
patent: 2008/0009155 (2008-01-01), Ide et al.
patent: 03190063 (1991-08-01), None

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