Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1993-06-29
1994-03-29
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
29412, 29890054, 174 163, 165 803, 165185, 257722, H05K 720
Patent
active
052990907
ABSTRACT:
A housed integrated circuit unit package is provided with a heat sink for removal and dissipation of heat from electronic circuits housed in packages. The heat sink, mounted on an outer surface of the package, includes a plurality of pins secured at one end with a retainer and flared out at the other end into a starburst or bouquet configuration, the pins being in the form of rods selected from solid cylinders and tubes. The bottom of the retainer-bound end is coated with a securing substance, such as solder or a heat-conducting adhesive, which is planarized to facilitate positioning of the heat sink on the package. The heat sink is secured to the package by means of solder or a heat-conducting adhesive. The heat sink is produced by securing a plurality of elongated rods by retainers placed at intervals corresponding to a height of the heat sink, cutting off said rods adjacent to one side of the retainer, and flaring the rods at the other free end of the cut-off rods into a starburst-like configuration. The retained ends of the rods are dipped into a solder or heat-conducting adhesive and planarized to provide a planar surface for mounting the heat sink on the surface of the package.
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Buller et al., "Dendritic Heat Sink", IBM Technical Disclosure Bulletin, vol. 23, No. 11, Apr. 1981, p. 4853.
Brady Kevin J.
Cohn Charles
AT&T Bell Laboratories
Oleg E. Albert
Thompson Gregory D.
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