Pin attach structure for an electronic package

Details Pin attach structure for an electronic package Pin attach structure for an electronic package

1997-04-16

1999-09-14

Hardy, David B.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257774, 257766, 257741, H01L 23532

Patent

active

059527161

ABSTRACT:
A pinning process including the steps of gold-plating through-holes in a laminate carrier and crimping a gold or gold-plated pin located in the through-holes to form a pin head on the top and a pin bulge on the bottom of the laminate carrier to produce a plastic pin grid array. A variety of mechanical forming processes may be employed to form the pin heads and pin bulges and cause the pin to at least partially, and preferably substantially, fill and contact the gold-plated through-hole including swage pinning, impact pinning, and double-die pinning operations. By combining the steps of gold-plating through-holes of a laminate carrier and using a mechanical pinning process to crimp a gold or gold-plated pin in the through-holes, a reliable mechanical and electrical connection may be established between the pin and the metal lines both inside and on the surface of the laminate carrier without the need for lead-containing solders and pastes.

REFERENCES:
patent: 4421368 (1983-12-01), Saban
patent: 4446477 (1984-05-01), Currie et al.
patent: 4618739 (1986-10-01), Theobald
patent: 4620215 (1986-10-01), Lee
patent: 4677526 (1987-06-01), Muehling
patent: 4688152 (1987-08-01), Chia
patent: 4742024 (1988-05-01), Sugimoto et al.
patent: 4791075 (1988-12-01), Lin
patent: 4816426 (1989-03-01), Bridges et al.
patent: 4822550 (1989-04-01), Komathu
patent: 4916522 (1990-04-01), Cohn
patent: 5006922 (1991-04-01), McShane et al.
patent: 5054192 (1991-10-01), Cray et al.
patent: 5073118 (1991-12-01), Grabbe et al.
patent: 5093282 (1992-03-01), Ohno et al.
patent: 5102829 (1992-04-01), Cohn
patent: 5195237 (1993-03-01), Cray et al.
patent: 5243757 (1993-09-01), Grabbe et al.
patent: 5288944 (1994-02-01), Bronson et al.
patent: 5456608 (1995-10-01), Rogers et al.
patent: 5537672 (1996-07-01), Newman
patent: 5629564 (1997-05-01), Nye, III et al.
Emerick, et al., "Pin Insertion into Pin Grid Arrays--Concepts, Equipment and Applications;" Proc. 1991 IEEE Southern Tier Technical Conference; Oct. 25, 1991; Binhamton, N.Y.; pp. 207-218.
Tummala et al.; "Microelectronics Packaging Handbook;" pp. 463, 782-787.
Cohn et al.; "Plastic Pin Grid Array Packages--the AT&T Experience;" Proc. Int'l Electronics Packaging Society, 1990; pp. 882-893.
"Alcoa Eyes Packaging Fates as Intel Embraces Plastic to replace ceramic pkg for the Pentium Processor with plastic replacement;" Electronic News; Jan. 1, 1996; p. 1.
Seraphim et al., "Principles of Electronic Packaging;" McGraw Hill: 1989, pp. 52-54 and 340-347, .COPYRGT.1989.
IBM Technical Brochure, No. SP1383 WPP-01 "Developments in Laminate Carrier Packaging," .COPYRGT.1995.
J. Knight et al., "Reliability Data for the IBM PBGA and PPGA Chip Carriers," 3 pp., 1995.
Electronic Engineering Times/Product File, pp. 1, 19, Oct. 21, 1996.
EDN Products Edition, SCI-1022, pp. 30, 43 Oct. 16, 1996.
Electronic Engineering Times, p. 82; Mar. 17, 1997.
IBM Technical Disclosure No. 744149M, pp. 1 and 6, Aug. 4, 1995.
IBM Technical Disclosure, ".mu.Laminate.TM. Plastic Ball Grid Array (PBGA)," .COPYRGT.1996.
Advertisement for Interconnect Systems, Inc. titled, "Need a BGA Adapter? ISI Has Solutions.".
IBM Technical Disclosure, "Flexible Alternatives in Packaging Technology," No. PCMHPCSFU-01, .COPYRGT.1994.

Affiliated with

Also associated with

Rating

Pin attach structure for an electronic package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pin attach structure for an electronic package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pin attach structure for an electronic package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1512540