Piezoelectric resonator with reduced deformation sensitivity

Details Piezoelectric resonator with reduced deformation sensitivity Piezoelectric resonator with reduced deformation sensitivity

2006-06-27

2006-06-27

Schuberg, Darren (Department: 2834)

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

Reexamination Certificate

active

07067964

ABSTRACT:
Reliable piezoelectric restraint mechanisms are provided that substantially reduce the ill effects of acceleration sensitivity through an increasingly rigid and precise orientation system. The piezoelectric resonator stress relief apparatus, devices and systems of the present invention resolve the long-standing disadvantages, limitations and shortcomings of acceleration sensitive resonators by stacking a number of rigid plates, layers and spring cushions around the piezoelectric resonator by means of a mounting structure that provides in-plane stress relief and precise definition of the mounting plane. The piezoelectric resonator stress relief apparatus, device and system can essentially eliminate any deformation or may include precisely defined features to tailor the allowed deformation of the piezoelectric resonator, without suffering from the long-standing disadvantages, limitations and shortcomings of prior art acceleration sensitive resonators. The piezoelectric resonator may be a bulk acoustic wave resonator (BAW) comprising a plano-plano, plano-convex or bi-convex thickness profile, or a surface acoustic wave resonator (SAW) comprising a plano-plano thickness profile. Spring cushions that may be formed as either separate components or assembled together with a piezoelectric resonator and a means for lateral restraint provide the in-plane stress relief. In other embodiments, the spring cushions may be an integral part of either the crystal resonator or lateral restraint or as part of a monolithic resonator-spring-restraint assembly.

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patent: 6800986 (2004-10-01), Yamauchi
patent: 2003/0015942 (2003-01-01), Takeshima et al.

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