Piezoelectric film type actuator, liquid discharge head, and...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

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C156S247000, C156S272200, C156S289000, C156S089120, C427S147000, C428S914000, C438S458000, C438S584000, C347S047000, C347S070000

Reexamination Certificate

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06911107

ABSTRACT:
A method for manufacturing a piezoelectric film type actuator, which is provided with a piezoelectric film and an oscillating plate structural member bonded therefor, comprises the steps of forming a piezoelectric film on an intermediate transfer member; bonding the piezoelectric film on the intermediate member and the oscillating plate structural member; and peeling off the intermediate transfer member from the piezoelectric film. Through the steps thus arranged, it becomes possible to enhance the bonding strength and durability of the piezoelectric film and the oscillating plate structural member without using a bonding agent in the manufacture of a highly reliable piezoelectric film type actuator.

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patent: 62-213399 (1987-09-01), None
patent: 06-320739 (1994-11-01), None
R. Herino et al. “Microstructure of Porous Silicon and its Evaluation with Temperature”,Mater. Lett., vol. 2(6A & B), pp. 519-523 (1984).

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