Piezoelectric device and method of manufacturing the same

Details Piezoelectric device and method of manufacturing the same Piezoelectric device and method of manufacturing the same

1996-07-18

1998-06-02

Dutton, Brian

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Having enclosed cavity

438458, 438460, H01L 2120, H01L 2176, H01L 21302, H01L 21463

Patent

active

057597537

ABSTRACT:
A piezoelectric device is manufactured by: (1) mirror finishing surfaces of a first substrate and a second substrate made of a piezoelectric element; (2) forming grooves on at least one of the two surfaces of the first and second substrates; (3) joining the mirror-finished surfaces of the first substrate and the second substrate; (4) applying heat to the joined substrates and bonding them; (5) forming an opening on the first substrate so that a part of the exposed areas of the second substrate is exposed through the opening; (6) forming piezoelectric devices by forming electrodes on at least one of the second substrate through the opening and a corresponding area to the exposed area on the rear side of the second substrate; and (7) dividing the bonded substrates into portions each having one of the piezoelectric devices. Through this manufacturing method, piezoelectric devices with high yield ratios and high reliability can be obtained.

REFERENCES:
patent: 4025954 (1977-05-01), Bert
patent: 4803392 (1989-02-01), Kushida et al.
patent: 5199298 (1993-04-01), Ng et al.
patent: 5342648 (1994-08-01), Mackenzie et al.
patent: 5441803 (1995-08-01), Meissner
patent: 5521454 (1996-05-01), Hattori et al.

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