Piezoelectric device and its manufacturing method

Details Piezoelectric device and its manufacturing method Piezoelectric device and its manufacturing method

2008-04-24

2011-10-25

Budd, Mark (Department: 2837)

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

C310S370000

Reexamination Certificate

active

08044557

ABSTRACT:
An upper adhesion layer35formed between a piezoelectricity layer32and an upper electrode layer34so as to abut on the piezoelectricity layer32and the upper electrode layer34is included. The upper adhesion layer35includes a first tungsten layer47made of tungsten in which an α phase and a β phase coexist and a second tungsten layer48made of α-phase tungsten. The first tungsten layer47is configured so as to abut on the piezoelectricity layer32. It is possible to obtain a piezoelectric device which is capable of improving the adhesion property of both the piezoelectricity layer and the electrode layer and reducing a basic point voltage fluctuation at the time of high-temperature operation so as to improve reliability.

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International Search Report issued Aug. 5, 2008 in International (PCT) Application No. PCT/JP2008/001074.

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