Piezoelectric device and a package

Details Piezoelectric device and a package Piezoelectric device and a package

1996-09-06

1998-12-08

Dougherty, Thomas M.

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

310346, H01L 4108

Patent

active

058474897

ABSTRACT:
A piezoelectric device includes a piezoelectric plate provided with at least one electrode at almost a central portion of each face; a first plate made of an ionic material having a recessed portion to cover the at least one electrode at one face to face the piezoelectric plate; and a second plate made of an ionic material having a recessed portion to cover the at least one electrode at one face to face the piezoelectric plate. Each of the at least one electrode is packaged by direct bonding the piezoelectric plate with the first plate and the second plate so as to be sandwiched therebetween. A package includes a body member made of an ionic material provided with a recessed portion or an opening, having a flat face around the recessed portion or the opening; and a covering member made of an ionic material having a flat face to cover the body member. The flat face of the body member and the flat face of the covering member are cleaned and attached to each other so as to be direct bonded with each other using hydrogen bonds generated between the ionic materials, thereby packaging the recessed portion or the opening.

REFERENCES:
patent: 2268365 (1941-12-01), Willard
patent: 2907680 (1959-10-01), Smith et al.
patent: 3397278 (1968-08-01), Pomerantz
patent: 4009516 (1977-03-01), Chiang et al.
patent: 4191905 (1980-03-01), Yasuda et al.
patent: 4266156 (1981-05-01), Kizaki
patent: 4270105 (1981-05-01), Parker et al.
patent: 4293986 (1981-10-01), Kobayashi et al.
patent: 4362961 (1982-12-01), Gerber
patent: 4464598 (1984-08-01), Besson et al.
patent: 4479070 (1984-10-01), Frische et al.
patent: 4633122 (1986-12-01), Radice
patent: 4639631 (1987-01-01), Chasan et al.
patent: 4665374 (1987-05-01), Fathimulla
patent: 4698820 (1987-10-01), Brandle, Jr. et al.
patent: 4967466 (1990-11-01), Takeya et al.
patent: 4983251 (1991-01-01), Haisma et al.
patent: 5075641 (1991-12-01), Weber et al.
patent: 5166646 (1992-11-01), Avanic et al.
patent: 5302879 (1994-04-01), Totty et al.
patent: 5304887 (1994-04-01), Heinecke et al.
patent: 5319324 (1994-06-01), Satoh et al.
patent: 5453652 (1995-09-01), Eda et al.
patent: 5483115 (1996-01-01), Haisma et al.
patent: 5548178 (1996-08-01), Eda et al.
patent: 5589724 (1996-12-01), Satoh et al.
J.P. Castera, "State of the art in design and technology of MSW devices (invited)", Journal of Applied Physics, 55 (6), pp. 2506-2511 (1984).
K. Matsumoto et al., "Preparation of bi-substituted YIG garnets by sol-gel synthesis and their magnetic properties", IEEE Translation Journal on Magnetics in Japan, vol. 6, No. 1, pp. 15-22 (Jan. 1991).
M. Totoki et al., "Demonstration of direct bonding between InP and gadolinium gallium garnet (Gd.sub.3 Ga.sub.5 O.sub.12) substrates". Electronics Letters, vol. 30, No. 18, pp. 1534-1536 (Sep. 1994).
J. Haisma et al., "Silicon-on-insulator wafer bonding-wafer thinning technological evaluations", Japanese Journal of Applied Physics, vol. 28, No. 8, pp. 1426-1443 (Aug. 1989).
M. Murakami et al., "Development of Compact Surface Mounting Tape Quartz Crystal Resonator Measuring 7.0X5.0X2.3mm.sup.3 ", Nikkei Electronics, pp. 163-169, Jan. 7, 1991 (partial translation provided).
C. Kittel, "3 Crystal Binding", Introduction to Solid State Physics, fifth edition, pp. 92-97 (1976).
European Search Report for EP 94101046 dated Jan. 4, 1996.

Affiliated with

Also associated with

Rating

Piezoelectric device and a package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Piezoelectric device and a package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Piezoelectric device and a package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-181069