Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2006-01-10
2006-01-10
Mayes, Melvin (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S250000, C156S256000, C156S257000, C156S268000, C310S311000
Reexamination Certificate
active
06984284
ABSTRACT:
A method is described for making a composite, such as a piezoelectric composite, having a predetermined volume ratio. Initially, a pair of base slabs are diced to form slot having uniform pitch spacing such that a material portion of one diced base slab may be received within the slots of another diced base slab. The diced base slabs are interdigitated and joined to form a first piezoelectric composite that can subsequently be diced to form slots having a uniform pitch spacing that are spaced from the first slots. Two diced first piezoelectric composites are interdigitated and joined to form a second piezoelectric composite of reduced volume ratio and finer pitch.
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Article entitled “Interdigital Pair Bonding for High Frequency (20-50 MHz) Ultrasonic Composite Transducers” by Ruibin Liu, Kasia A. Harasiewicz and F. Stuart Foster, Printed in the IEEE Transaction on Ultrasonics, Ferroelectrics, and Frequency Control, vol. 48, No. 1, Jan. 2001.
Article entitled “2-2 Piezoelectric Composites with High Density and Fine Sale Fabricated by Interdigital Pair Bonding” by Ruibin Liu, Kasia A. Harasiewicz, D. Knapik, N.A. Freeman and F. Stuart Foster, Printed in the Applied Physics Letters, vol. 75, No. 21, Nov. 22, 1999.
Article entitled “Fabrication of 2-2 Piezoelectric Composites by Interdigital Pair Bonding” by Ruibin Liu, Donald Knapik, Kasia A. Harasiewicz and F. Stuart Foster, Printed in the 1999 IEEE Ultrasonic Symposium, 1999.
Foster Francis Stuart
Harasiewicz Katarzyna Anna
Yin Jainhua
Mayes Melvin
Needle & Rosenberg PC
Sunnybrook and Women's College Health Sciences Centre
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