Piece-wise processing of very large semiconductor designs

Details Piece-wise processing of very large semiconductor designs Piece-wise processing of very large semiconductor designs

1997-10-23

2000-07-18

Berman, Jack I.

Radiant energy

Irradiation of objects or material

Irradiation of semiconductor devices

364491, H01J 37302

Patent

active

060910720

ABSTRACT:
A system and method of converting large Integrated Circuit (IC) designs into patterns. First, based on shape density, the design is fragmented into pieces, each piece including roughly the same number of shapes. Next, a band of shapes, all within the proximity correction area for each piece, are identified. Each piece, including its identified band, is processed individually to convert data within the piece and within the proximity correction band to Numerical Control (NC) data. The NC data for the proximity correction band is discarded. The piece's NC data is stored as an NC data file for the piece. This is repeated until all of the pieces are converted to NC data. Finally, the pattern is written, one piece at a time.

REFERENCES:
patent: 4816692 (1989-03-01), Rudert, Jr.
patent: 4890238 (1989-12-01), Klein et al.
patent: 4989156 (1991-01-01), Ikenaga
patent: 5113352 (1992-05-01), Finnerty
patent: 5294800 (1994-03-01), Chung et al.
patent: 5493509 (1996-02-01), Matsumoto et al.
patent: 5526279 (1996-06-01), Dick

Affiliated with

Also associated with

Rating

Piece-wise processing of very large semiconductor designs does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Piece-wise processing of very large semiconductor designs, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Piece-wise processing of very large semiconductor designs will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2039010