Pickup chuck for double sided contact

Details Pickup chuck for double sided contact Pickup chuck for double sided contact

1997-12-16

2001-02-13

Metjahic, Safet (Department: 2858)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S762010

Reexamination Certificate

active

06188230

ABSTRACT:

BACKGROUND OF THE INVENTION
1). Field of the Invention
The present invention relates generally to testing of semiconductor chip packages and, more specifically, to a pickup chuck which is used in combination with a contactor for purposes of testing a semiconductor chip package, and to a method of making electrical contact between a semiconductor chip package and a contactor.
2). Discussion of Related Art
FIG. 1
of the accompanying drawings shows a conventional semiconductor chip package
10
comprising a package substrate
12
and a semiconductor chip
14
located on the package substrate
12
. An integrated circuit is located within the semiconductor chip
14
. The integrated circuit is placed in electrical communication with the package substrate
12
via an array of solder balls
16
. Electrical leads
18
lead through the package substrate
12
to a set of contact pads
20
on an opposing surface of the package substrate
12
. A semiconductor chip such as the semiconductor chip
14
of
FIG. 1
is usually tested after being located on the package substrate
12
and before being shipped out.
FIG. 2
illustrates diagramatically a portion of a conventional pickup chuck
26
, for purposes of picking up a semiconductor chip package
10
such as in
FIG. 1
, defining a recess
28
. The pickup chuck is positioned over the semiconductor chip package
10
with the semiconductor chip package
10
located within the recess
28
and seating on an inner surface
30
of the recess
28
. Suction pads or the like (not shown), are then operated so as to retain the semiconductor chip package
10
within the recess
28
. Utilizing the pickup chuck
26
, the semiconductor chip package
10
is then transported to a contactor which is electrically connected to an electrical test unit.
FIG. 3
illustrates the pickup chuck
26
which is used in combination with a contactor
32
for purposes of electrically connecting the contact pads
20
to the electric test unit. The contactor
32
has a locating formation
34
therein which receives the pickup chuck
26
, and a set of pogo pins
36
, located within the locating formation
34
, each of which making contact with a respective contact pad
20
. Electrical leads
38
extend from the pogo pins
36
and eventually end up within the electric test unit. The semiconductor chip
14
is thus electrically connected to the test unit via the array of solder balls
16
, the electric leads
18
, the contact pads
20
, the pogo pins
36
, and the electric leads
38
. Two of the electric leads
38
A and
38
B are respectively connected to a power source and electric ground for purposes of supplying electric power to the semiconductor chip
14
and supplying the semiconductor chip
14
with electric ground. Note that the electric power and electric ground are supplied to the semiconductor chip package
10
via two of the contact pads
20
, all of the contact pads being located on a single surface of the package substrate
12
.
FIG. 4
illustrates recent developments in the technology of Intel Corporation of Santa Clara, Calif. wherein electric contacts are provided on opposing surfaces of the package substrate.
FIG. 4
shows a semiconductor chip package
50
which includes a package substrate
52
and a semiconductor chip
54
located on the package substrate
52
. Electric connection between an integrated circuit within the semiconductor chip
54
and the package substrate
52
is made via an array of solder balls
56
. The package substrate
52
is made in layers which include a first metal layer
58
and a second metal layer
60
. The first and second metal layers
58
and
60
each has a exposed region at the end of the package substrate
52
. The exposed regions are positioned so as to form a first electric contact
62
on a chip side of the package substrate
52
and a second electric contact
64
on a non-chip side of the package substrate
52
. First and second electric leads
66
A and
66
B connect the semiconductor chip
54
electrically to respectively the first metal layer
58
and the second metal layer
60
. Electric power is supplied to the semiconductor chip
54
by application of a power source to the first electric contact
62
, and electric ground is supplied to the semiconductor chip
54
by application of electric ground to the second electrical contact
64
. More electric leads
68
extend through the package substrate
52
to contact pads
70
on the non-chip side of the package substrate
52
. The contact pads
70
serve to provide logic communication to the semiconductor chip
54
.
It can thus be seen that the semiconductor chip package
50
has electric contacts on opposing sides thereof, as opposed to the semiconductor chip package
10
of
FIG. 1
which only has electric contact pads on one side thereof. A test arrangement is therefore required which can make contact with all contacts. Although the description that follows is primarily directed at apparatus for purposes of handling the semiconductor chip package
50
of
FIG. 4
, it should be understood that the invention resides in the broader concept of making electric contact with contacts on opposing sides of a semiconductor chip package, regardless of the exact positioning or purpose of the contacts.
SUMMARY OF THE INVENTION
The invention provides a pickup chuck which includes a body defining a recess for receiving a semiconductor chip package, and an electrically conductive element mounted within the recess. The electrically conductive element comprises a first portion contacting an electrical contact on the semiconductor chip package facing into the recess, and a second portion extending from the first portion past an edge of the semiconductor chip package in a direction which is out of the recess.


REFERENCES:
patent: 5006792 (1991-04-01), Malhi et al.
patent: 5049813 (1991-09-01), Van Loan et al.
patent: 5309324 (1994-05-01), Herandez et al.
patent: 5367253 (1994-11-01), Wood et al.
patent: 5435733 (1995-07-01), Chernicky et al.
patent: 6054757 (2000-04-01), Kobayashi

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